INTECH | Intech Technologies International (S) Pte. Ltd.
We are a team of an experienced energetic entrepreneurs that
started INTECH back in year 2008. We embark in our
semiconductors adventure believing in innovation, integration
and interdependent-focused solutions in post fabrication and
semiconductors packaging services. Focusing on our customers’
requirements and the significance of time-to-market, we want to
help our customers stay competitive in the semiconductor market
by offering solutions that is fast in lead time and more efficient in
the integrated circuits fabrication packaging services.
At Intech, we understand your needs and are flexible in working
with your engineering team to create the right solution to meet
your expectations. Our solutions are focused on helping you to
bring your products to market faster, to gain the competitive
edge, and stay ahead in your industry.
What We Do
INTECH takes up the challenges of making
the best and precise results in meeting
every customer’s goal with innovative and
integrated solutions for variety of industry
applications. We provide a wide range of
post fabrication and packaging services
for semiconductor and electronics
manufacturers, helping you to transit
your product from wafer to usable die
with faster lead time.Thus,enable you to stay
competitive in market with reduced time-to-
Wafer Backgrinding | Wafer Thinning
Wafer Backgrinding | Wafer Thinning
INTECH offers standard backgrinding
and bumped wafer backgrinding. We
use automated state-of-the-art wafer
backgrinding equipment to achieve the
highest level of quality available and can
continuously achieve thin wafer target
thicknesses up to 0.05 mm for 8” and
12” wafers. We provide bumped wafer
backgrinding, standard wafer grinding,
single die backgrinding, and custom
wafer backgrinding all with streamlined
With our state-of-the-art dicing equipment,
Intech offers wafer dicing services that covers
half cut and full cut. Understanding your
need, we offer fast turnaround time to
get your product ready for final assembly.
The fully automated wafer dicing process
employ are able to constantly meet
individual business needs in meeting the
tight industry requirements.INTECH dicing do provides the capability to dice MEMS wafers, ceramic, glass and bismaleimide-triazine substrate panels.
• To complement our wafer dicing, INTECH offers automated die sorting services. Our die sorting systems work on import wafer maps or ink dot recognition.
• Die sort projects that do not lend themselves to automation are not a problem; our trained personnel along with manual die sorting systems are available too.
• Die sort is packaged to chip tray or Gel Pak® or as per customer requirements.
• Whether you require high volume production or a single wafer prototype build, INTECH has the die sorting solution for you.
Following wafer dicing, INTECH can assemble your dies into open cavity plastic or ceramic substrate. INTECH provide standard die bonding services using
adhesive based on your requirements. INTECH do provide flip-chip, stacked die and chip on board assembly capability. INTECH can also provide customized labeling and barcoding on chips for your specific needs.
INTECH provides standard wire bonding services that is cost-effective and flexible for the vast majority of semiconductor packages. Our standard wire bonding services include gold ball bonding and aluminium wedge bonding.
Flip Chip Bonding
Flip Chip Bonding
As the trend of consumer products
driven towards the requirement of
smaller, lighter and thinner devices,
INTECH offers smaller package type
solution, flip chip, just for that market.
Flip chip is an integrated circuit
fabrication packaging that provides
smaller than traditional carrierbased
system with less inductance,
higher signal speed and better heat
conducting, hence making it suitable
for specific applications such as
SEM (Scanning Electron Microscope)
SEM (Scanning electron microscope) is available to provide our customer with failure analysis and process characterization. The SEM can produces representations of three-dimensional views from target object and allows target surface analysis to be performed.
To further enhance failure analysis where the product has been encapsulated, X-ray system is available that provides high magnification, high contrast and highly detailed real-time images for failure analysis. The detailed X-ray image is capable to inspect interconnections wires on IC as well as pin point defects such as solder joint shorts, opens and voids.
Die Shear | Wire Pull
The shear system has a unique 'programmable shear height' feature that gives consistently accurate positioning over a wide range of height applications. The height reference is taken, prior to the shear, from a soft landing of the shear tool on the substrate adjacent to the bond being tested.
The wire pull system has a range of test cartridges that allows the machine to perform bond strength over a wide range of loads.
In INTECH, we are a team of experienced personnel that focus on the
research and development that specialized in various areas
that can help you in your business. We specialized in many
fields namely; military, mobile communications, robotics, IT
manufacturing, smart cards, and many others.
We are certified ISO 9001:2008